Hosted by Forge Nano, Semitronics, and CSconnected.

As demand for AI infrastructure, advanced sensing, and power electronics continues to accelerate, compound semiconductors are increasingly critical to the next generation of electronic devices. However, scaling these technologies from research and pilot production to high-volume manufacturing presents significant process integration and cost challenges.

Join Forge Nano, Semitronics, and CSconnected, with a special guest speaker from the North Carolina-based CLAWS Hub, for an exclusive technical seminar exploring how Atomic Layer Deposition (ALD) is enabling the future of compound semiconductor manufacturing. Presentations from industry experts and leading researchers, will provide insight into the growing role of ALD in emerging photonics, RF devices, power electronics, and advanced packaging technologies. The seminar will examine the unique functional advantages of ALD while addressing one of the industry's key questions: how can ALD be deployed economically at manufacturing scale?

Why Attend?

· Learn about the newest innovations in the manufacturability of ALD

· Understand which device markets are seeing the biggest upside of ALD

· Dive into real-world device performance using ALDx

· Explore partnership opportunities and regional collaboration for critical device manufacturing

· Connect with peers in a focused, high-value setting.

Who Should Attend

Semiconductor equipment and process specialists focused on thin film deposition (PVD, CVD, ALD)

Technology and R&D leaders working in compound semiconductor device fields

Industry and academic cleanroom/manufacturing leaders interested in new equipment innovation

Description supplied by the event organiser.